Samsung Electronics has partnered up with Baidu to produce its new cloud-to-edge artificial intelligence (AI) chip, Kunlun, with mass production slated for early next year, the companies announced. It is the first such partnership between the South Korean tech giant and Chinese search behemoth. Kunlun will be built on Baidu's own XPU neural processor architecture for cloud, edge, and AI and will be made with Samsung's 14nm process. The South Korean company will also make the chips using its I-CubeTM, or interposed-cube, package solution. I-Cube integrates a System-on-a-Chip (SoC) and a High Bandwidth Memory (HBM) onto a silicon interposer to create a single package to increase electrical transference.